advanced power n-channel enhancement mode electronics corp. power mosfet 100% avalanche test bv dss 100v single drive requirement r ds(on) 35m fast switching characteristic i d 39a description absolute maximum ratings symbol units v ds v v gs v i d @t c =25 a i d @t c =100 a i dm a p d @t c =25 w t stg t j symbol value units rthj-c maximum thermal resistance, junction-case 1.2 /w rthj-a maximum thermal resistance, junction-ambient 110 /w data and specifications subject to change without notice thermal data parameter storage temperature range total power dissipation 125 -55 to 175 operating junction temperature range -55 to 175 continuous drain current, v gs @ 10v 27 pulsed drain current 1 80 gate-source voltage 20 continuous drain current, v gs @ 10v 39 parameter rating drain-source voltage 100 AP40T10GH rohs-compliant product 1 g d s advanced power mosfets from apec provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. g d s to-252(h) the to-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. 200712141
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =1ma 100 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =15a - - 35 m v gs =6v, i d =10a - - 38 m v gs(th) gate threshold voltage v ds =v gs , i d =250ua 2 - 4 v g fs forward transconductance v ds =15v, i d =15a - 14.5 - s i dss drain-source leakage current v ds =80v, v gs =0v - - 10 ua drain-source leakage current (t j =125 o c) v ds =80v ,v gs =0v - - 100 ua i gss gate-source leakage v gs =20v - - 100 na q g total gate charge 2 i d =40a - 24 40 nc q gs gate-source charge v ds =50v - 5.4 - nc q gd gate-drain ("miller") charge v gs =10v - 9.6 - nc t d(on) turn-on delay time 2 v ds =50v - 9 - ns t r rise time i d =40a - 64 - ns t d(off) turn-off delay time r g =2.5 ? v gs =10v - 19 - ns t f fall time r d =1.25 -75- ns c iss input capacitance v gs =0v - 1310 2100 pf c oss output capacitance v ds =25v - 270 - pf c rss reverse transfer capacitance f=1.0mhz - 85 - pf source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =30a, v gs =0v - - 1.2 v t rr reverse recovery time 2 i s =30a, v gs =0 v , - 60 - ns q rr reverse recovery charge di/dt=100a/s - 125 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test this product is an electrostatic sensitive, please handle with caution. device or system are not authorized. AP40T10GH this product has been qualified for consumer market. applications or uses as criterial component in life support 2
AP40T10GH fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 20 40 60 80 0 4 8 12 16 v ds , drain-to-source voltage (v) i d , drain current (a) t c = 175 o c 10v 7.0v 6 .0v 5.0 v v g = 4.5 v 20 30 40 50 246810 v gs , gate-to-source voltage (v) r ds(on) (m ) i d =10a t c =25 o c 0.4 0.8 1.2 1.6 2.0 2.4 2.8 -50 0 50 100 150 200 t j , junction temperature ( o c) normalized r ds(on) i d =15a v g =10v 0 4 8 12 16 20 0 0.2 0.4 0.6 0.8 1 1.2 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =175 o c 0.0 0.6 1.2 1.8 -50 0 50 100 150 200 t j , junction temperature ( o c) normalized v gs(th) (v) 0 25 50 75 100 125 024681012 v ds , drain-to-source voltage (v) i d , drain current (a) t c =25 o c 10v 7.0v 6.0v 5.0v v g =4.5v
fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. switching time waveform fig 12. gate charge waveform 4 AP40T10GH q v g 10v q gs q gd q g charge 10 100 1000 10000 1 5 9 13 17 21 25 29 v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0 2 4 6 8 10 12 0 102030 q g , total gate charge (nc) v gs , gate to source voltage (v) v ds =50v i d =40a 0.1 1 10 100 1000 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) i d (a) t c =25 o c single pulse 100us 1ms 10ms 100ms dc 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse t d(on) t r t d(off) t f v ds v gs 10% 90%
package outline : to-252 millimeters min nom max a2 1.80 2.30 2.80 a3 0.40 0.50 0.60 b1 0.40 0.70 1.00 d 6.00 6.50 7.00 d1 4.80 5.35 5.90 e3 3.50 4.00 4.50 e3 f 2.20 2.63 3.05 f1 0.5 0.85 1.20 e1 5.10 5.70 6.30 e2 0.50 1.10 1.80 e -- 2.30 -- c 0.35 0.50 0.65 1.all dimensions are in millimeters. 2.dimension does not include mold protrusions. part marking information & packing : to-252 symbols advanced power electronics corp. e e d d1 e2 e1 f b1 f1 a2 a3 c r : 0.127~0.381 ( 0.1mm part package code 40t10gh ywwsss date code (ywwsss) y last digit of the year ww week sss sequence logo meet rohs requirement
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